Our group investigates thermal flow sensors on solid and flexible substrates. Outstanding parameters are high temperature stability, chemical resistance and high sensitivity.
Sensor integration works on the embedding of sensors in materials. The goal is to integrate the sensor into materials in such a way that macroscopic properties, like for example the material stability, are not influenced. To reach this aim, smaller sensor elements and new material embedding techniques are necessary.
Together with cognition scientists we develop neuroimplants with the long-term objective to convey optical impressions through a cortical visual prosthesis to a blind person.
In the project “The Intelligent Container” a sensor network is developed which measures parameters of perishable goods, for example the ripeness level of fruits inside a container. Using ripeness models, the remaining shelf-life is estimated whereby the logistic process is improved.
Jedermann R, Behrens C, Westphal D, Lang W (2006). Applying autonomous sensor systems in logistics combining Sensor Networks, RFIDs and Software Agents. Sensors and Actuators A: Physical 132(1):370-375.
Buchner R, Sosna C, Maiwald M, Benecke W, Lang W (2006). A high-temperature thermopile fabrication process for thermal flow sensors. Sensors and Actuators A: Physical 130-131:262-266.
Geiger W, Butt U, Gaißer A, Frech J, Braxmaier M, Link T, Kohne A, Nommensen P, Sandmaier H, Lang W (2002). Decoupled Microgyros and the Design Principle Daved. Sensors and Actuators A: Physical 95:239-249.
Lang W (1995). Silicon Microstructuring Technology. Mat Sci Eng: Reports R17:1-55.
Steiner P, Lang W (1995). Micromachining Application of Porous Silicon. Thin Solid Films Vol. 255:52-58.